If Infineon fails to do that, then the 30 percent cut in revenue and a move away from a sector that is clearly strategic in the 21st century, just hurts the company's economies of scale and would be bad for both shareholders and the European semiconductor industry more generally. After all Infineon has already got out of memories with the collapse of Qimonda, and wireline communication chips with the creation of Lantiq. With the sale of the wireless business unit Infineon needs to start showing some growth or risk being seen as a hulk being broken up.

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LP2967IBP-2528_Datasheet PDF

时间:2021-06-14 00:33:04 来源:网络整理编辑:RPM Systems

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If Infineon fails to do that, then the 30 percent cut in revenue and a move away from a sector that is clearly strategic in the 21st century, just hurts the company's economies of scale and would be bad for both shareholders and the European semiconductor industry more generally. After all Infineon has already got out of memories with the collapse of Qimonda, and wireline communication chips with the creation of Lantiq. With the sale of the wireless business unit Infineon needs to start showing some growth or risk being seen as a hulk being broken up.

If Infineon fails to do that, then the 30 percent cut in revenue and a move away from a sector that is clearly strategic in the 21st century, just hurts the company's economies of scale and would be bad for both shareholders and the European semiconductor industry more generally. After all Infineon has already got out of memories with the collapse of Qimonda, and wireline communication chips with the creation of Lantiq. With the sale of the wireless business unit Infineon needs to start showing some growth or risk being seen as a hulk being broken up.

Our mission is to make 3-D through-silicon via (TSV) both manufacturable and affordable. We will prove its very real advantages over conventional, two-dimensional designs — especially in increased functionality and performance,” said Sitaram Arkalgud director of 3-D Interconnect at Sematech, in a statement.

Launched in 2005, Sematech's 3-D program was established to enable 300-mm equipment and process technology solutions for TSV manufacturing. During 2009, the program began to demonstrate 300-mm tooling, materials, and process module solutions necessary for 3-D TSV manufacturing for 300-mm wafers in 2012 and beyond.

LP2967IBP-2528_Datasheet PDF

Chip makers have been talking about this technology for a decade. Many see mass adoption for TSVs in 2012 or so. But to date, there are ''no significant quantities of 3D-TSV technology after 10 years'' in R&D, according to VLSI Research. ''High-volume TSV is still some years away.''

The global market for 3-D chips is forecast to reach $5.2 billion by the year 2015, according to Global Industry Analysts Inc.

SAN FRANCISCO—Contract manufacturers are facing a challenging supply imbalance characterized by tight inventories of components and a glut of raw materials as part shortages have created a traffic pileup” in the global electronics supply chain, according to a report by market research firm iSuppli Corp.

LP2967IBP-2528_Datasheet PDF

A snapshot of inventory at five of the larger electronic manufacturing service (EMS) providers showed that components and raw materials accounted for nearly 70 percent of total inventories during the first quarter of 2010, the latest date for which quarterly data is available, iSuppli (El Segundo, Calif.) said. In comparison, work-in-process goods made up about 17 percent of inventories, while finished goods comprised less than 15 percent, according to the firm's analysis.

Finished goods were at their lowest level since the fourth quarter of 2008—and the imbalance is likely to persist, according to Thomas Dinges, iSuppli EMS and ODM analyst.

LP2967IBP-2528_Datasheet PDF

ISuppli believes that the current trend—in which electronics inventories are being weighed down by an overwhelmingly large percentage of raw materials—will continue for some time to come, given that more product in kits are waiting to be finished,” Dinges said, in a statement.

Availability : WaferPro is distributed with Agilent’s IC-CAP 2010.08 software.

For more information, please visit www.agilent.com/find/eesof-iccap.

LONDON — An exploding cell phone likely caused the death of a man near a village south of Jaipur, in northern India, according to reports.