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B72210S2551K101_Datasheet PDF

时间:2021-06-14 01:22:12 来源:网络整理编辑:Foxconn

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Mike Hickey, CEO of Wolfson, said: This is a significant milestone for Wolfson, and we are delighted to be making this announcement. Having worked closely with Samsung over recent years on their GALAXY range of tablets and smartphones, this agreement is a testament to our strong IP portfolio and our growing partnership, and we very much look forward to working closely together to continue to deliver exceptional audio in Samsung’s smartphones and tablets.”

Visit Wolfson Microelectronics at www.wolfsonmicro.com

B72210S2551K101_Datasheet PDF

This article originally appeared on EE Times Europe.

The founder and CEO of Chinese networking equipment manufacturer Huawei, in his first-ever media interview, Thursday dismissed allegations that backdoors may have been built into the company's products to facilitate Chinese espionage.

Huawei has no connection to the cybersecurity issues the U.S. has encountered in the past, current and future,” Huawei CEO Ren Zhengfei, 68, told local reporters — through an interpreter — while on a visit to New Zealand this week, according to news reports.

B72210S2551K101_Datasheet PDF

Since founding the company 26 years ago, Ren had previously refused to conduct media interviews. But during his visit this week to New Zealand, he agreed to meet with reporters from four of the country's news outlets.

Click to read the rest of this article on Information Week.

B72210S2551K101_Datasheet PDF

EM Microelectronic, the semiconductor company of the Swatch Group, has introduced a versatile and multipurpose, battery-assisted passive (BAP) RFID chip with a calibrated temperature sensor.

The EM4325V11 chip enables accurate remote temperature monitoring using industry standard EPC Gen2 wireless protocol. Temperature data logging can easily be implemented with a companion Microcontroller connected to the EM4325V11 via a standard SPI interface.

The projected cut will be the second straight year of deliberate downsizing following an 8% drop-off last year. This year's output is expected to be slashed by 5% compared to 2012, as shown below.

Curtailing DRAM capacity is a positive move for the industry, resulting in a gradual normalization between supply and demand for DRAM. The industry is now believed to be perhaps slightly undersized relative to demand moving forward because of the intentional slash in output, and DRAM pricing can continue to remain firm if production remains slightly behind demand.

DRAM revenue in the first quarter rose to its highest level in nearly two years, thanks to a jump in commodity prices spurred by demand from the server PC and mobile PC segments. Pricing for the bellwether 4-gigabyte DDR3 module rose to $23 in March, up from $16 in December, an unusually large increase.

The DRAM industry has struggled with major challenges in recent years, including chronic oversupply and slowing demand from its main market, the PC business,” said Mike Howard, senior principal analyst for DRAM and memory at IHS. This has LED to continued weak pricing, financial losses and market revenue declines. However, the DRAM industry has entered a more mature state, enacting structural changes that will allow it to grow even in challenging market conditions.”

DRAM market enters the post-PC era In one major change, the DRAM market is adjusting to the fact that demand is diversifying away from PCs alone to servers and mobile devices. Nearly 65% of all DRAM bit shipments went to a desktop or laptop 10 years ago, but that figure is less than 50% today and will fall further to south of 40 percent by the end of next year.