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1202530245_Datasheet PDF

时间:2021-06-14 00:40:12 来源:网络整理编辑:Taiwan Semiconductor

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NewPort will provide Broadcom with CMOS optical-commu-nications technologies for the next generation of Sonet/SDH and 10-Gigabit Ethernet networks, Nicholas said.

NewPort will provide Broadcom with CMOS optical-commu-nications technologies for the next generation of Sonet/SDH and 10-Gigabit Ethernet networks, Nicholas said.

The rollout of CompactPCI could be slowed by differing definitions and applications for the specification and connector. Although some OEMs refer to the connectors they use as CompactPCI-compatible, they in fact use proprietary form factors,” asserted Lindsay Powell, telecommunications market development manager at the 3M Interconnect Solutions Division (Austin, Texas). There are more people using their version of things rather than using the CompactPCI version of things.”

Powell said the IEC spec, 1076-4-101, that has been adopted has been used under a number of different platforms, including CompactPCI. It's also used by large telecommunications equipment companies in ways unique to those companies,” he said. If they were going to go to the open market and buy a CompactPCI card, unless the signaling has been worked out, they will find that there are incompatibilities. But if you adopt CompactPCI, the spec, then you're guaranteed interoperability with other pieces of equipment that are designed to Compact PCI.”

1202530245_Datasheet PDF

3M doesn't offer a board-to-board CompactPCI connector, Powell added, but it plans to. In the meantime, the company is pitching its new MDR cable assembly, called the 3M Mini Delta Ribbon, to meet similar challenges that CompactPCI connectors face: taking high-speed signals off the backplane and routing those to other parts of the same equipment or to other equipment

With our MDR system, we're maintaining the data rate or keeping within the skew budget that the engineers set, and we're not using undue levels of power to achieve all that,” Powell said. The goal is more bandwidth without necessarily consuming vast numbers of signal pins and ground pins, so we're able to achieve that to a large degree. We've been able to get 1.6 Gbits/second per pair over a 5-meter distance.”

The MDR cable assembly is available in two board-mount styles: a straight and a right-angle version. Pricing is $2.42 for a 26-position, right-angle surface-mount assembly, in 5,000 pieces.

1202530245_Datasheet PDF

Connector suppliers are readying their next releases around the CompactPCI specification. While CPCI is based on five rows of signals and two outer rows for ground shields, Fujitsu's Thornton said his company plans to release a higher-density version in the next month or so that will feature eight rows of signals and two for ground.

In the longer term, he added, Fujitsu plans to release a higher-speed connector with improved matched-impedance characteristics; the connector would likely feature additional grounding blades, Thornton said.

1202530245_Datasheet PDF

Robinson Nugent Inc. (New Albany, Ind.) is on a similar product release trajectory. Like the high-density connector that Fujitsu is readying, Robinson Nugent's eight-row hard-metric connector, called the HM, is equivalent to the CompactPCI connector in size, said Doug Draut, product manager. The component is available in vertical and horizontal shieldings. As a fully shielded part it can get up to 5 GHz,” Draut said.

FCI's Brown said his company plans to introduce in volume in the first quarter 2001 AB modules that will tout additional guiding features to enable more reliable blind mating on 3U and 6U CompactPCI boards. He said FCI also plans to release vertical receptacles, known as mezzanine connectors, which enable mating with standard headers so that two circuit boards are parallel.

SINGAPORE–ST Assembly Test Services Ltd. today announced the completion of a $5 million expansion of its chip-packing and testing facility here, increasing the plant's cleanroom space by 80,000 square feet for final assembly of high-end digital and mixed-signal ICs. The expansion will accommodate up to 200 more IC testers and other gear, according to STATS, which says the plant is now one-third larger at 300,000 square feet.

We're in a state of readiness to quickly ramp up in response to business demand — whether for test, packaging, or full turnkey services,” declared J.C. Lee, chief operating officer of STATS. With the completion of facilitization works, equipment can be progressively installed in a relatively short time in step with customers' orders.”

The contract assembly and testing house said it has begun installing additional production equipment to support higher unit volumes from customers in the second half of 2000. Earlier, STATS said its revenues were impacted by a shortage of processed wafers, but the volume of silicon substrates ready for final packaging and testing have increased since June (see July 21 story).

Concerns about backend assembly demand and the possibility that the chip industry is overbuilding capacity hit the stock markets last week when Kulicke & Soffa Industries Inc. announced delays in tool orders (see Aug. 3 story). But since last Thursday, a number of chip companies and backend assembly houses have re-emphasized their positive outlooks for the second half of 2000.

Singapore-based STATS said it now has 209 testers and 460 wire bonders for final assembly of ICs. The company said it has expanded its capabilities in advanced packaging technologies and added high-frequency testers for wireless communications during the year.