时间：2021-06-14 01:03:35 来源：网络整理编辑：RushUp
According to Peter Bocko, chief technology officer for East Asia at Corning Research, consumers' HD viewing experience does not match the high expectations associated with HDTV. The problem is not necessarily the set itself, but the limitations of the delivery pipeline that brings the signal to the set,” said Bocko.
The challenge for the HDTV industry is to sync up the fast-improving TV capability with the content delivery infrastructure, which is developing at a slower pace.
Bocko detailed Corning's research to quantify these issues during a panel session Friday (Jan. 9) at the International Consumer Electronics Show in Las Vegas.
While consumers are adopting HDTV in greater numbers, anecdotal evidence indicates that product return rates to retailers remain high. Bocko sees an opportunity to apply Corning's research in glass substrates and fiber optics to pinpoint possible solutions.
Corning's targeted research into display network requirements could help benchmark the requirements needed for optimal HDTV performance. By sharing our proprietary research findings, we hope to benefit the entire HDTV market,” said Bocko.
He added in an interview that the disconnect between HDTV receiver capability and network delivery performance is partially due to the speed at which HDTV technology has arrived. By 2012, two-thirds of North American households will own an HDTV, according to market researcher DisplaySearch. What's more, sets that formerly broadcast only television programming and movies are now sophisticated multimedia portals.
Thus, content providers are increasingly churning out higher-quality digital offerings, further increasing the need for a robust content delivery pipeline.
Even high-end HDTVs may come up short due to network quality issues, including content delivery bandwidth, bit rate and video compression constraints. Bocko added that 3-D and Quad HD technologies will demand up to eight times more bandwidth to support performance; lacking that, consumers may conclude that HDTV technology doesn't measure up.
Corning researchers are developing the infrastructure needed to support future display technologies. For instance, using an optical testbed to emulate fiber-to-the-home, cable television and digital subscriber loop networks combined with new display technologies, Corning engineers have been able to analyze how content delivery and network capabilities affect HDTV viewing. Among the metrics are variations in bit and compression rates, display size and type and network characteristics.
Japanese-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.75 in November, down from 0.81 in October, according to the Semiconductor Equipment Association of Japan (SEAJ).
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.00 in November, up from 0.96 in September, according to SEMI. A book-to-bill of 1.00 means that $100 worth of orders were received for every $100 of product billed for the month.
''The book-to-bill ratio reached parity as billings have declined sharper than bookings over the past six months,'' said Stanley Myers, president and CEO of SEMI, in a statement. ''2008 is closing with expected declines on the year, which have been further exacerbated by the deepening seismic global economicsituation over the past quarter.''
The three-month average of worldwide bookings in November 2008 was $805.4 million. The bookings figure is about 4 percent less than the final October 2008 level of $839.7 million, and about 29 percent less than the $1.13 billion in orders posted in November 2007.
The three-month average of worldwide billings in November 2008 was $807.3 million. The billings figure is about 7 percent less than the final October 2008 level of $871.4 million, and about 42 percent less than the November 2007 billings level of $1.38 billion.
transistors for sale2021-06-14 00:48
6 volt dc power supply2021-06-14 00:38
what is the purpose of a resistor in a circuit2021-06-13 23:16
in circuit transistor testing2021-06-13 22:54
a semiconductor material2021-06-13 22:48